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PCB上串扰的耦合机理和优化分析模型
引用本文:吕飞燕,沙斐.PCB上串扰的耦合机理和优化分析模型[J].电子与信息学报,2005,27(7):1167-1170.
作者姓名:吕飞燕  沙斐
作者单位:北京交通大学电子信息工程学院抗电磁干扰研究中心,北京,100044
摘    要:本文从频域与时域两个方面分析了PCB上的串扰的耦合机理,探究了耦合电容以及近端和远端电阻的影响。针对2-π串扰电路模型所提出的时域上的数学优化模型,明确了信号上升沿对干扰输出的影响。并且利用Hyperlynx软件包进行仿真,比较了耦合电容、耦合长度等的作用结果,仿真结果证明了理论分析的正确性。

关 键 词:耦合电容  串扰  优化  仿真
文章编号:1009-5896(2005)07-1167-04
收稿时间:2004-2-19
修稿时间:2004年2月19日

The Coupling Mechanism and Optimization Analysis Model for Crosstalk in PCB
Lu Fei-yan,Sha Fei.The Coupling Mechanism and Optimization Analysis Model for Crosstalk in PCB[J].Journal of Electronics & Information Technology,2005,27(7):1167-1170.
Authors:Lu Fei-yan  Sha Fei
Affiliation:EMC Lab,College of E&I,Beijing Jiaotong University,Beijing 100044, China
Abstract:The coupling path of crosstalk in PCB is analyzed both in the frequency and the time domains in this paper. The influence of the coupling capacitance and the resistances near and far from the source in the victim circuit is investigated. The optimization model is derived mathematically in time domain for the 2-kkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkkk circuit model. The conclusion is deduced that the maximum crosstalk is derived from the rising edge of the aggressive signal. The simulation results by use of Hyperlynx software are compared with regards to the coupling capacitance and the coupling length, which demonstrate the theoretical conclusion.
Keywords:Coupling capacitance  Crosstalk  Optimization  Simulation    
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