| JBQ-3200型全自动金属膜剥离清洗系统研制技术 |
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| 引用本文： | 陈仲武,宋文超,张伟锋,刘永进.JBQ-3200型全自动金属膜剥离清洗系统研制技术[J].电子工业专用设备,2013,42(4):49-54. |
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| 作者姓名： | 陈仲武 宋文超 张伟锋 刘永进 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,101601 |
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| 摘 要： | 主要介绍了JBQ-3200型全自动金属膜剥离清洗系统设备功能、用途、结构组成、性能指标、主要特点,以及解决的关键技术和应用,能自动完成厚度在0.25～0.7 mm的准100～准200 mm具有基准边的标准圆片微细图形金属膜剥离、清洗和甩干工艺,剥离线宽能做到0.35μm以上,是声表面波(SAW)器件、GaAs微波、毫米波器件、MEMS器件、OLED器件和先进封装等器件制造工艺中的关键设备。
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| 关 键 词： | 金属膜剥离 自动传输系统 剥离清洗腔体 CCD中心定位 电气控制 软件系统 |
The Techniques of the JBQ-3200 Metal Lift-Off System |
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| CHEN Zhongwu
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SONG Wenchao
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ZHANG Weifeng
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LIU Yongjin.The Techniques of the JBQ-3200 Metal Lift-Off System[J].Equipment for Electronic Products Marufacturing,2013,42(4):49-54. |
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| Authors: | CHEN Zhongwu SONG Wenchao ZHANG Weifeng LIU Yongjin |
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| Affiliation: | (The 45th Research Institute of CETC,Beijing 101601,China) |
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| Abstract: | In this paper, the JBQ-3200 Automatic Metal Lift-Off System is introduced, including its functions, usage, structure, performance parameters, main characteristics, key techniques and applications. The JBQ-3200 Automatic Metal Lift-Off System can be used in metal lift-off process, wafer clean process and wafer drying process for wafer 0.25-0.7 mm in thickness and 100-200 mm in diameter. The system can reach a peeling line width 0.35μm. The JBQ-3200 Automatic Metal Lift-Off System is a key machine which can be used in the manufacturing of SAW device, GaAs microwave and millimeter-wave device, MEMS device, OLED device, advanced packaging and so on. |
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| Keywords: | Metal Lift-Off Wafer transfer system Metal lifting and cleaning Cavity CCD aligner Rotating axis Chuck Electric system Software system |
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