| 表面组装技术的发展趋势 |
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| 引用本文： | 鲜飞.表面组装技术的发展趋势[J].电子工业专用设备,2009,38(1):8-14. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 表面组装技术自20世纪80年代以来以在电子工业中得到了广泛应用和发展，从SMT生产线、SMT设备、元器件和工艺材料等几个方面浅谈SMT技术的发展趋势。
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| 关 键 词： | 表面组装技术 计算机集成制造系统 SMT生产线 贴片机 波峰焊 再流焊 |
Developing Trend of Surface Mount Technology |
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| XIAN Fei.Developing Trend of Surface Mount Technology[J].Equipment for Electronic Products Marufacturing,2009,38(1):8-14. |
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| Authors: | XIAN Fei |
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| Affiliation: | XIAN Fei (Fiberhome Telecommunication Technologies Co., Lid, Wuhan 430074, China) |
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| Abstract: | Surface Mount Technology has been developed quickly and got wide application in electronic industry since 1980,the article introduces the developing trend of Surface Mount Technology,including SMT line,SMT equipment,component and material. |
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| Keywords: | Surface Mount Technology CIMS SMT line Placer Wave soldering Reflow soldering |
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