| 强迫风冷电子设备的热仿真与热测试数据对比分析 |
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| 引用本文： | 曹红,吕倩,韩宁.强迫风冷电子设备的热仿真与热测试数据对比分析[J].电讯技术,2008,48(7). |
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| 作者姓名： | 曹红 吕倩 韩宁 |
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| 作者单位： | 1. 中国西南电子技术研究所,成都,610036
2. 西安电子科技大学,西安,710071 |
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| 摘 要： | 以典型强迫风冷电子设备为例,通过将热测试的试验数据与电子设备结构优化设计支撑软件热分析子系统仿真出的结果相比较,进一步验证电子设备结构优化设计支撑软件热分析模块的分析精度,检验其在工程实践中的可靠性,为工程技术人员提供可参考的资料和数据。
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| 关 键 词： | 电子设备 结构设计 强迫风冷 热仿真 热测试 数据分析 |
Comparative Analysis of Heat Simulation and Heat Test Data of a Forced Air Cooling Electronic Equipment |
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| CAO Hong,L.Comparative Analysis of Heat Simulation and Heat Test Data of a Forced Air Cooling Electronic Equipment[J].Telecommunication Engineering,2008,48(7). |
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| Authors: | CAO Hong L |
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| Affiliation: | CAO Hong,L(U) Qian,HAN Ning |
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| Abstract: | Based on a typical forced air cooling electronic equipment,the accuracy and reliability of heat analysis module of electronic equipment structure optimization supporting software are proved through comparing the test data with the simulated results.It is hoped that the analysis can provide reference materials and data for engineers. |
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| Keywords: | electronic equipment structure design forced air cooling heat simulation heat test data analysis |
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