| 液晶显示器模块IC构装技术 |
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| 引用本文： | 魏向东,李春耕,范志新.液晶显示器模块IC构装技术[J].现代显示,2010(11):30-34. |
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| 作者姓名： | 魏向东 李春耕 范志新 |
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| 作者单位： | [1]河北工业大学应用物理系,天津300401 [2]江门亿都半导体有限公司,广东江门529030 |
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| 摘 要： | 文章综述了目前LCM的几种构装技术，并以列表的形式对其各项指标进行了比较，最后得出结论：Fine Pitch导通技术是未来研究的重点。
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| 关 键 词： | 表面黏结技术 板上连接芯片 卷带自动连接 玻璃上接芯片 薄膜上接芯片 |
IC Packaging Technology of LCD Module |
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| WEI Xiang-dong,LI Chun-geng,FAN Zhi-xin.IC Packaging Technology of LCD Module[J].Advanced Display,2010(11):30-34. |
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| Authors: | WEI Xiang-dong LI Chun-geng FAN Zhi-xin |
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| Affiliation: | 1. Department of Applied Physics, Hebei University of Technology, Tianjin 300401, China ;2. Jiangmen Yeebo Semiconductor Co., Ltd., Jiangmen Guangdong 529030, China) |
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| Abstract: | This paper in the form of summary,introduces several packaging technologies of LCM, and compared their indicators in the form of a list. Finally make a conclusion： Fine Pitch conduction technology is the focus of future research. |
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| Keywords: | SMT COB TAB COG COF |
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