| LCD切割裂片不良及解决方法 |
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| 引用本文： | 宋新华,范志新.LCD切割裂片不良及解决方法[J].现代显示,2010(11):18-22. |
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| 作者姓名： | 宋新华 范志新 |
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| 作者单位： | [1]河北工业大学理学院,天津300400 [2]江门亿都半导体有限公司,广东江门529000 |
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| 摘 要： | 文章汇总了LCD后制程中切割裂片的常见不良，根据切割裂片原理，分析了不良产生的原因，并通过实验给出了改进的方法。
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| 关 键 词： | LCD 后制程 切割裂片 |
The Defects of LCD Scribing and Breaking,and It's Solution |
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| SONG Xin-hua,FAN Zhi-xin.The Defects of LCD Scribing and Breaking,and It's Solution[J].Advanced Display,2010(11):18-22. |
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| Authors: | SONG Xin-hua FAN Zhi-xin |
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| Affiliation: | 1. Department of Applied Physics, Hebei University of Technology, Tianjin 300400, China; 2. Jiangmen Yeebo Semiconductor Co., Ltd., Jiangmen Guangdong 529000, China) |
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| Abstract: | The common defects of LCD scribing and breaking was collected. The reasons casing the defects was analyzed, according to the scribing and breaking principle. The improvements was given through the experiment. |
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| Keywords: | LCD back-end process scribing breaking |
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