| 声表面波器件压电芯片粘接工艺的可靠性研究 |
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| 引用本文： | 陈台琼,吴燕,唐代华.声表面波器件压电芯片粘接工艺的可靠性研究[J].电子质量,2003(6):89-91. |
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| 作者姓名： | 陈台琼 吴燕 唐代华 |
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| 作者单位： | 中国电子科技集团公司第二十六研究所八室 |
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| 摘 要： | 本文对声表面波(SAW)器件失效模式以及SAW器件粘片失效模式进行了初步分类和探讨。通过对粘片工序几种失效模式的对比试验，总结了一套针对该工序的较为完整的粘片可靠性增长的控制措施。
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| 关 键 词： | 声表面波器件 SAW 失效模式 粘片 粘接强度 可靠性 |
Study on Reliability of Bonding Technique For Piezodielectric Chip in Surface Acoustic Wave Device |
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| CHENG Tai-qiong WU Yan TANG Dai-hua China Electronics Technology Group Company,No. Research Institute,No. Dept.Study on Reliability of Bonding Technique For Piezodielectric Chip in Surface Acoustic Wave Device[J].Electronics Quality,2003(6):89-91. |
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| Authors: | CHENG Tai-qiong WU Yan TANG Dai-hua China Electronics Technology Group Company No Research Institute No Dept |
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| Affiliation: | CHENG Tai-qiong WU Yan TANG Dai-hua China Electronics Technology Group Company,No.26 Research Institute,No.8 Dept |
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| Abstract: | The article preliminarily classifies and discusses the failure modes of surface acoustic wave (SAW) devices and failure modes of SAW device bonding. Through the control tests for several failure modes of bonding technique, it summarizes a relatively complete set of controlling measures for enhanced bonding reliability. |
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| Keywords: | surface acoustic wave device bonding strength reliability research |
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