| Ni电极片式多层陶瓷电容器产生开裂的几种因素分析 |
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| 引用本文： | 卢艺森,刘新,肖培义.Ni电极片式多层陶瓷电容器产生开裂的几种因素分析[J].电子质量,2008(9). |
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| 作者姓名： | 卢艺森 刘新 肖培义 |
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| 作者单位： | 广东风华高新科技股份有限公司,广东肇庆,526020 |
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| 摘 要： | 在片式多层陶瓷电容器的生产制作过程中,电容器开裂现象是比较常见的质量问题之一。本中对陶瓷介质与内电极浆料的匹配、膜片密度、Ni重、排胶、烧结这五个因素是如何导致电容器开裂进行了深入的分析。
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| 关 键 词： | 开裂 陶瓷介质 内电极浆料 膜片密度 Ni重 排胶 烧成 |
Analysis of Severed Factors of the Cracking of Ni Electrode Chip Multi-layer Ceramic Capacitors |
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| Lu Yi-sen,Liu Xin,Xiao Pei-yi.Analysis of Severed Factors of the Cracking of Ni Electrode Chip Multi-layer Ceramic Capacitors[J].Electronics Quality,2008(9). |
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| Authors: | Lu Yi-sen Liu Xin Xiao Pei-yi |
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| Abstract: | The crack defect is a very normal quality problem during the MLCC manufacturing.How the five causes,ceramic dielectric and inner electrode paste,the ceramic tape density,the Ni layer weight,BBO and sintering,cause to capacitor crack were deeply studied. |
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| Keywords: | crack ceramic dielectric inner electrode paste ceramic tape density Ni layer weight BBO sintering |
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