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| 高速PCB板地分割引起的电磁兼容性问题分析 | |
| 引用本文： | 李富同,余海涛,秦伟芳.高速PCB板地分割引起的电磁兼容性问题分析[J].电子质量,2006(6):86-89. |
| 作者姓名： | 李富同 余海涛 秦伟芳 |
| 作者单位： | 1. 东南大学电气工程系,南京,210096;安捷伦科技上海有限公司,上海,200131 2. 东南大学电气工程系,南京,210096 3. 安捷伦科技上海有限公司,上海,200131 |
| 摘 要： | 本文介绍了在高速PCB板中由于时钟信号线穿越地分割引起的电磁辐射问题并给出了解决方案,使用EMC仿真工具对其进行了仿真。并分析论证了在一定条件下EMC与环路面积、信号完整性之间的关系。 |
| 关 键 词： | 电磁兼容 电磁辐射 地分割 信号完整性 高速PCB板 |
| 文章编号： | 1003-0107（2006）06-0086-04 |
The EMC Issue Analysis Resulted from Ground Partitioning in High Speed PCB Board |
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| Li Fu-tong,Yu Hai-tao,Qin Wei-fang.The EMC Issue Analysis Resulted from Ground Partitioning in High Speed PCB Board[J].Electronics Quality,2006(6):86-89. | |
| Authors: | Li Fu-tong Yu Hai-tao Qin Wei-fang |
| Affiliation: | 1 .Dept. of Electrical Eng., Southeast University, Nanjing 210096 China;2.Agilent Technologies (Shanghai |
| Abstract: | This paper analyzes the problem of radiated emission resulted from ground partitioning in high speed PCB board, and provides some solutions to solve such issues with EMC simulation tools. Also this paper explains the relations among EMC, Signal Integrity and Circle Area with theory and experiments based on some cases. |
| Keywords: | EMC Radiated Emission Ground Split Signal Integrity High Speed Board |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |