微晶磷铜球中磷对电镀的影响

采用两种不同牌号、直径为28mm的微晶磷铜球作为实验材料,通过直读光谱仪、EDS、电子天平和哈氏槽实验仪分析了不同磷铜球中磷的含量及分布、电镀效率、电镀槽体系中电流与电阻随电镀时间的变化规律。结果表明,磷含量较高的微晶磷铜表面能够较快速地形成磷膜,且磷元素分布越均匀,电镀过程中形成的磷铜黑膜均匀性就越好;磷铜球表面钝化的形成降低了电镀效率;1h后电阻随电镀时间的增加而缓慢地升高或维持在一定范围内,表明了磷铜黑膜持续稳定的形成且降低了磷离子的释出效率。

Effect of Phosphorus on Electroplating in Microcrystalline Phosphorus Copper Balls

With the rapid development of electronic communication, the requirements for high-end printed circuit boards are getting higher and higher. As an anode material for electroplating, it is of practical significance to study the effect of phosphorus on electroplating in microcrystal phosphorus and copper spheres. In this paper, two kinds of microcrystal phosphorus copper balls with different diameters of 28mm were used as test materials. The content and distribution of phosphorus in different phosphorus copper spheres, electroplating efficiency, current and resistance in electroplating bath system with electroplating time were analyzed by direct reading spectrometer, EDS, electronic balance and Harrard cell tester. The results show that the phosphorus film can be formed rapidly on the surface of microcrystal phosphorus copper with high phosphorus content. The more uniform the distribution of phosphorus element is, the better the uniformity of phosphorus copper black film formed in the electroplating process. The passivation of phosphorus copper ball surface reduces the electroplating efficiency. One hour later, the resistance increased slowly with the increase of electroplating time or maintained in a certain range, indicating the continuous and stable formation of phosphorus-copper black film and the decrease of phosphorus ion release efficiency.