石墨电摩擦材料电镀法镀铜研究

采用酸性硫酸盐电镀铜方法在石墨电摩擦材料基体上成功地镀覆上铜镀层。研究了电镀电压大小、时间及添加剂对镀铜效果的影响,探索了最佳钝化工艺,确定了合适的石墨电摩擦环电镀铜工艺,讨论了不同工艺条件对镀铜样品表面电阻率的影响。研究结果表明:在60～100 g/L CuSO4.5H2O、55 g/L H2SO4及50 mg/L HCl组成的镀液中加入适量添加剂,室温条件(约20℃)下恒压(1 V)电镀10 min后样品含铜量为9.9%,镀层致密平整,最低表面电阻率为2.0μΩ.m。样品在50～60℃的钝化液(0.5%BTA+0.5%OP10+蒸馏水)中浸泡5 min获得最佳钝化效果。

Study of Copper Electroplating on Graphite Electro-friction Materials

Copper was successfully electroplated on graphite electro-friction materials using acidic sulfate electroplating technique.The effects of voltage magnitude,electroplating time and additives on the copper plating results were investigated.An optimized deactivation process was discussed.A suitable electroplating technique for graphite electro-friction loops was determined.The influences of different technological conditions on surface resistivity of the samples were analyzed.The results show that on the surface of the sample with 9.9wt% Cu,a dense and even Cu electroplating layer with a minimum surface resistivity of 2.0 μΩ·m could be obtained by electroplating for 10 minutes at room temperature(about 20 ℃) and a constant voltage(1 V) in the plating solution consisting of CuSO4·5H2O of 60~100 g/L,H2SO4 of 55 g/L and HCl of 50 mg/L and a certain amount of additive.When the sample soaks in passivating solution(0.5% BTA+0.5%OP-10+purified water) at 50~60 ℃ for 5 minutes,an optimum passivation result can be achieved.