电子组装用SnAgCu系无铅钎料合金与性能

论述无铅钎料替代的紧迫性,综述无铅钎料的发展现状,特别讨论了以SnAgCu三元系合金为代表的无铅钎料的特点与优势。SnAgCu三元钎料合金在一个较大成分范围熔化温度都接近共晶温度,在SnAgCu钎料合金中添加微量La、Ce混合稀土,构成新的四元合金,既能保持SnAgCu钎料的优良物理性能及钎焊工艺性能,又能显著提高SnAgCu合金的抗蠕变性能及服役可靠性,同时钎料成本低廉,具有自主知识产权,在钎料的生产和使用上将免于国外专利的困扰,为国内钎料生产企业提供了有竞争性的无铅焊料合金。另外,采用微米／亚微米颗粒,可进一步增强无铅钎料的抗蠕变性能及组装接头的尺寸稳定性,可满足光通讯、宇航、汽车等电子设备制造的特殊要求。

SnAgCu Lead- free Solders and Performance for Electronic Assembly

The pressure on searching for substitution of lead-containing solder is indicated and the development of lead free alternative technologies are reviewed. The feature and superiority of lead-free solders in representative of SnAgCu alloys are discussed. The melt temperature range of the SnAgCu alloys with wide range of composition is near eutectic temperature. The new SnAgCu quarternary alloy is formed by adding small amount of mixture rare earth element. The new SnAgCu quarternary alloy not only has the excellent physical properties and technological performance for soldering, but also obviously increases the anti-creep property of the SnAgCu solder and reliability for service. At the same time the solder is with low cost. As the new solder alloy is with independent knowledge property right, production and application of the solder will exclude the obsession of foreign patents. This result will provide a competent lead-free solder alloy for the home enterprise. In addition lead-free solder alloy can be further enhanced with micro/nano particles. The enhanced solder will exhibit excellent anti-creep property and size stability for the soldered joints, and meet the requirements of electronic facilities and installation used in special fields such as optical communication, space navigation, and automobile industry.