| 世界及我国电解铜箔业的发展回顾 |
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| 引用本文： | 祝大同.世界及我国电解铜箔业的发展回顾[J].世界有色金属,2003(8):7-11. |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京远创铜箔设备有限公司 |
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| 摘 要： | 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。本文从电解铜箔的生产、市场、技术等方面,记述、回顾了世界及我国的发展过程和有关的重要事件。
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| 关 键 词： | 印制电路板 覆铜板 电解铜箔 低轮廓铜箔 |
A review in retrospect of development of electrolytic copper foil industries both at home and abroad |
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| Zhu Da - tong.A review in retrospect of development of electrolytic copper foil industries both at home and abroad[J].World Nonferrous Metals,2003(8):7-11. |
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| Authors: | Zhu Da - tong |
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| Affiliation: | Beijing Yuanchung Copper Foil Equipment Corp. |
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| Abstract: | The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. A review of these years in retrospect of development of electrolytic copper foil industries both at home and abroad with important events is presented in terms of production markets, technologies thereof. |
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| Keywords: | Printed circuit board electrolytic copper foil cover copper plate low profile copper foil |
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