| 化学镀铜原理、应用及研究展望 |
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| 引用本文： | 马立涛,郭忠诚,朱晓云,王洪益.化学镀铜原理、应用及研究展望[J].南方金属,2009(2). |
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| 作者姓名： | 马立涛 郭忠诚 朱晓云 王洪益 |
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| 作者单位： | 昆明理工大学材料与冶金工程学院,云南,昆明,650093 |
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| 摘 要： | 化学镀铜在表面处理行业中的地位不断提升,在电子工业、机械工业以及航空航天等工业中有着越来越广泛的应用.有关化学镀铜的机理及化学镀铜新工艺的研究也成为表面处理领域研究的新热点.文章介绍了化学镀铜的原理及化学镀铜应用,指出了化学镀铜所面临的主要问题和未来的主要研究方向.
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| 关 键 词： | 化学镀铜 机理 表面技术 应用 |
Mechanism,applications and prospects of electroless copper plating |
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| MA Li-tao,GUO Zhong-cheng,ZHU Xiao-yun,WANG Hong-yi.Mechanism,applications and prospects of electroless copper plating[J].Southern Metals,2009(2). |
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| Authors: | MA Li-tao GUO Zhong-cheng ZHU Xiao-yun WANG Hong-yi |
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| Affiliation: | School of Materials and Metallurgical Engineering;Kunming University of Science and Technology;Kunming 650093;Yunnan |
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| Abstract: | Electroless copper-plating technique is increasingly used for surface treating in electronic,mechanical,and aerospace industries.The investigations on the mechanism and new processes of electroless copper-plating have become one of the most interesting topics in surface treating industry.The mechanism and the applications of electroless copper-plating technique are described,the problems existing in electroless copper-plating reviewed,and the future research directions presented in the paper. |
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| Keywords: | electroless copper-plating mechanism surface treating industry applications |
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