| 真空开关和电子器件用钨铜材料 |
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| 引用本文： | 吕大铭.真空开关和电子器件用钨铜材料[J].粉末冶金工业,1998(6). |
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| 作者姓名： | 吕大铭 |
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| 作者单位： | 钢铁研究总院 |
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| 摘 要： | 随着真空开关和电子器件新应用的开发，发展了钨铜材料的新系列—真空钨铜材料。本文介绍了真空钨铜材料的特点、制取工艺及主要性能，并讨论了与应用有关的问题。
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| 关 键 词： | 真空钨铜材料 制造工艺 性能 应用 |
TUNGSTEN COPPER MATERIALS USED IN VACUUM SWITCHES AND ELECTRONICS |
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| Lu Daming.TUNGSTEN COPPER MATERIALS USED IN VACUUM SWITCHES AND ELECTRONICS[J].Powder Metallurgy Industry,1998(6). |
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| Authors: | Lu Daming |
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| Abstract: | Vacuum tungsten copper materials,new series of tungsten copper material have been developed with the new application development of vacuum switch and electronics.The features,process,major properties as well as relatives to applications of the vacuum tungsten copper materials are presented. |
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| Keywords: | Vacuum tungsten copper material process property application |
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