| 铜加工及引线框架材料的研究开发现状 |
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| 引用本文： | 师阿维,柳瑞清. 铜加工及引线框架材料的研究开发现状[J]. 铜业工程, 2011, 0(2): 42-44,61 |
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| 作者姓名： | 师阿维 柳瑞清 |
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| 作者单位： | 陕西金堆城股份有限公司金属分公司,西安,710177 |
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| 基金项目： | 国家863计划资助项目 |
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| 摘 要： | 本文概述了我国及国际铜加工业的发展现状、铜合金引线框架材料的研究开发现状及稀土在铜合金中的应用,介绍了引线框架是集成电路(IC)中的重要部件。同时,提出了今后铜加工及引线框架材料的研究方向及发展趋势。
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| 关 键 词： | 铜加工 铜合金 引线框架材料 集成电路 发展 |
The Research of Copper Processing and Leadframe Materials for Integrated Circuits |
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| SHI A-wei,LIU Rui-qing. The Research of Copper Processing and Leadframe Materials for Integrated Circuits[J]. Copper Engineering, 2011, 0(2): 42-44,61 |
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| Authors: | SHI A-wei LIU Rui-qing |
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| Affiliation: | SHI A-wei,LIU Rui-qing(JDC Co.,Ltd.,Xi'an,Shanxi,China 710177) |
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| Abstract: | The current status of research on copper processing and the copper alloy lead frame materials in this paper were overviewed and application of rare earth elements in copper alloy,lead frame is the important components of integrated circuit(IC).Meanwhile,the research direction and trend of the copper processing and lead frame materials are proposed. |
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| Keywords: | copper processing copper alloy material for lead flame integrated circuit development |
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