| 钨铜复合材料的应用与研究现状 |
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| 引用本文： | 范景莲,彭石高,刘涛,成会朝.钨铜复合材料的应用与研究现状[J].稀有金属与硬质合金,2006,34(3):30-35,19. |
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| 作者姓名： | 范景莲 彭石高 刘涛 成会朝 |
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| 作者单位： | 中南大学粉末冶金国家重点实验室,湖南,长沙,410083 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 在简述钨铜复合材料具有良好导热、导电性和高温抗氧化性等优良性能及其在电子封装、集成电路、国防军工、航空航天等高尖端技术的应用拓展空间的基础上，介绍了国内外钨铜材料的主要应用领域和制备新工艺的研究发展现状。
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| 关 键 词： | 钨铜复合材料 制备技术 应用与研究 |
| 文章编号： | 1004-0536（2006）03-0030-06 |
| 收稿时间： | 2005-11-23 |
| 修稿时间： | 2005-11-232005-12-07 |
Application and Latest Development of W-Cu Composite Materials |
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| FAN Jing-lian,PENG Shi-gao,LIU Tao,CHENG Hui-chao.Application and Latest Development of W-Cu Composite Materials[J].Rare Metals and Cemented Carbides,2006,34(3):30-35,19. |
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| Authors: | FAN Jing-lian PENG Shi-gao LIU Tao CHENG Hui-chao |
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| Affiliation: | State Key Laboratory for Power Metallurgy,Central-south University, Changsha 410083, China |
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| Abstract: | Descrlption is made of the W-Cu composite materials in respect of its performance such as good thermal and electric conductivity and high-temperature oxidization-resistance,its wide applications in the high-tech fields of electron sealing,integrated circuit, national defense military, aerospace. In the paper is introduced the main applications and latest development of new technology of the W-Cu materials both at home and abroad. |
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| Keywords: | W-Cu composite material production technology application and development |
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