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Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints |
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| Authors: | RS Sidhu N Chawla |
| Affiliation: | (1) School of Materials, Fulton School of Engineering, Arizona State University, Tempe, AZ 85287-8706, USA;(2) Present address: Assembly Technology Development Department, Intel Corporation, Chandler, AZ, USA |
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