Characterization of In-Based Eutectic Alloys Used in Josephson Packaging

InBiSn and InSn eutectic alloy solders used for Josephson packaging were characterized for the basic understanding of their behavior. Both physical structures and mechanical properties of these solders were studied under various conditions which partly simulate the processing and environmental exposure of these materials. Their interaction with the interface material (Pd/Au) was also probed in an attempt to understand the failure mechanism and to assess the package reliability.