| 纳米SiO_2改性EP/BMI/CE树脂体系固化动力学研究 |
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| 引用本文： | 吴广磊,寇开昌,晁敏,卓龙海,蒋洋.纳米SiO_2改性EP/BMI/CE树脂体系固化动力学研究[J].中国胶粘剂,2011,20(8). |
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| 作者姓名： | 吴广磊 寇开昌 晁敏 卓龙海 蒋洋 |
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| 作者单位： | 西北工业大学理学院应用化学系,陕西西安,710129 |
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| 基金项目： | 西北工业大学2011年度研究生创业种子基金(Z2011010) |
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| 摘 要： | 采用非等温差示扫描量热(DSC)法对纳米二氧化硅/环氧树脂/双马来酰亚胺/氰酸酯(nano-SiO2/EP/BMI/CE)树脂进行了固化反应动力学和固化工艺研究。通过Kissinger法和Ozawa法求得了nano-SiO2/EP/BMI/CE树脂体系固化反应动力学的表观活化能。结果表明:改性CE树脂体系的固化工艺参数为凝胶温度112℃、固化温度195℃及后处理温度213℃,进而确定了改性CE树脂体系的最佳固化工艺条件为"150℃/3 h→180℃/3 h→200℃/2 h";改性CE树脂体系的平均表观活化能为59.90 kJ/mol。
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| 关 键 词： | 纳米二氧化硅 氰酸酯树脂 环氧树脂 双马来酰亚胺树脂 固化动力学 |
Study on curing kinetics of EP/BMI/CE resin system modified by nano-SiO_2 |
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| Wu Guanglei,Kou Kaichang,Chao Min,Zhuo Longhai,Jiang Yang.Study on curing kinetics of EP/BMI/CE resin system modified by nano-SiO_2[J].China Adhesives,2011,20(8). |
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| Authors: | Wu Guanglei Kou Kaichang Chao Min Zhuo Longhai Jiang Yang |
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| Affiliation: | Wu Guanglei,Kou Kaichang,Chao Min,Zhuo Longhai,Jiang Yang(Department of Applied Chemistry,College of Science,Northwestern Polytechnical University,Xi'an 710129,China) |
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| Abstract: | The curing reaction kinetics and curing process for an EP(epoxy resin)/BMI(bismaleimide)/CE(cyanate ester)resin modified by nano-SiO2 were investigated by non-isothermal differential scanning calorimetry(DSC).The apparent activation energy of curing reaction kinetics for nano-SiO2/EP/BMI/CE resin was calculated by Kissinger method and Ozawa method.The results showed that the curing process parameters(such as the gelling temperature at 112 ℃,curing temperature at 195 ℃ and post-treatment temperature at 213 ℃) of modified CE resin system were obtained,and the optimal curing process conditions of modified CE resin system were ascertained for"150 ℃/3 h→180 ℃/3 h →200 ℃/2 h".The average apparent activation energy of modified CE resin system was 59.90 kJ/mol. |
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| Keywords: | nano-SiO2 cyanate ester resin epoxy resin bismaleimide resin curing kinetics |
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