首页 | 本学科首页   官方微博 | 高级检索  
     

基于Moldflow的储物盒注塑成型模拟及试验验证
引用本文:黄可,许成中,刘江,马雪峰,卜凡.基于Moldflow的储物盒注塑成型模拟及试验验证[J].工程塑料应用,2019,47(8):86-90.
作者姓名:黄可  许成中  刘江  马雪峰  卜凡
作者单位:常州机电职业技术学院机械工程学院,常州,213164;常州机电职业技术学院机械工程学院,常州,213164;常州机电职业技术学院机械工程学院,常州,213164;常州机电职业技术学院机械工程学院,常州,213164;常州机电职业技术学院机械工程学院,常州,213164
基金项目:2019 年江苏省大学生创新创业训练计划项目;2019 年常州机电职业技术学院校级课题项目;江苏省高等职业教育高水平骨干专业建设项目
摘    要:对储物盒盖的注塑难点进行分析,得出模具应设计成单热流道双腔结构。选取熔体温度、注射时间、保压压力、保压时间为研究对象,利用Moldflow 2018模流分析软件,构建4因素4水平正交试验,通过极差分析,得出储物盒盖在熔体温度226℃、注射时间14 s、保压压力70 MPa、保压时间10 s的条件下,变形总量最小,为0.45 mm。对获得的最优参数进行了试验验证,验证结果表明,成型后储物盒盖整体外观良好;佐证了Moldflow 2018有限元分析数据准确,正交试验构建及模具设计合理。

关 键 词:熔体温度  注射时间  保压压力  保压时间  模流分析  正交试验

Simulation and Test Verification of Storage Box Injection Molding Based on Moldflow
Huang Ke,Xu Chengzhong,Liu Jiang,Ma Xuefeng,Bu Fan.Simulation and Test Verification of Storage Box Injection Molding Based on Moldflow[J].Engineering Plastics Application,2019,47(8):86-90.
Authors:Huang Ke  Xu Chengzhong  Liu Jiang  Ma Xuefeng  Bu Fan
Affiliation:(School of Mechanical Engineering,ChangZhou Vocational Institute of Mechatronic Technology,Changzhou 213164,China)
Abstract::It is concluded that the mould should be designed with single hot runner and double cavity structure.Solution temperature,injection time,holding pressure and holding time were selected as the research objects.By using Moldflow 2018 mold flow analysis software,constructs the four factors,four levels orthogonal experiment,through the analysis of the poor,it is concluded that storage lifted the lid on the melt temperature of 226℃,14 s injection time,holding pressure 70 MPa,the holding time under the condition of 10 s,deformation amount,the smallest is 0.45 mm.The results show that the overall appearance of the storage box cover is good after molding.It proves that the accuracy of Moldflow 2018 finite element analysis data,and the orthogonal test construction and mold design are reasonable.
Keywords:solution temperature  injection time  holding pressure  holding time  mold flow analysis  orthogonal test
本文献已被 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号