| 一种新型印刷电路板蚀铜水的研制 |
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| 引用本文： | 阮复昌,范娟.一种新型印刷电路板蚀铜水的研制[J].广东化工,1998(2):24-25. |
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| 作者姓名： | 阮复昌 范娟 |
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| 作者单位： | 华南理工大学化学工程研究所，华南理工大学化学工程研究所，华南理工大学化学工程研究所，华南理工大学化学工程研究所，华南理工大学化学工程研究所 广州，510641，广州，510641，广州，510641，广州，510641，广州，510641 |
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| 摘 要： | 本文论述了一种新型印刷电路板蚀铜水及其开发思路和蚀铜动力学，研究结果表明，该蚀铜水不仅显著地提高了传统氨基蚀铜水的蚀铜速度，而且有效地抑制了氨的挥发，从而增加了蚀铜水的稳定性和蚀铜量，降低了生产成本。
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| 关 键 词： | 蚀铜水 动力学 印刷电路板 电子线路 腐蚀介质 |
Development of a New-type copper-corrodent for etched plates |
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| Ruan Fuchang,Fan Juan,Mo Binglu,Gong Guoqing,Lu Yanling.Development of a New-type copper-corrodent for etched plates[J].Guangdong Chemical Industry,1998(2):24-25. |
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| Authors: | Ruan Fuchang Fan Juan Mo Binglu Gong Guoqing Lu Yanling |
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| Abstract: | A new-type copper-corrodent for etched plates and its development rdea are reported in this paper, and its corroding dynamics is studied quite carefully. The experimental results show that the new-type copper-corrodent can accelerate the etching speed remarkably, and restrain the volatility of ammonia effectively, and therefore strengthen its stability, increase its capacity and decrease the production cost. |
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| Keywords: | copper-corrodent Development Dynamics |
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