Obtaining of high surface roughness copper deposits by electroless plating technique |
| |
Authors: | Eugenijus Norkus Algirdas Vaškelis Jan? Ja?iauskien? Irena Stalnionien? Giedrius Stalnionis |
| |
Affiliation: | Department of Catalysis, Institute of Chemistry, A. Goštauto 9, LT-01108 Vilnius, Lithuania |
| |
Abstract: | The use of pyridine-2,6-dicarboxylic and 4-hydroxypyridine-2,6-dicarboxylic acids as copper(II) ligands in formaldehyde-containing alkaline electroless copper plating solutions allowed to obtain copper layers with extremely high surface roughness factor reaching approximately 120. The Cu deposits of higher surface area were formed at highly negative open-circuit (mixed) potentials; the correlation between copper electrode overpotential and roughness of the deposit was found and discussed. The copper films obtained demonstrate a high electrocatalytic activity in anodic formaldehyde oxidation process, the oxidation rate reaches 40 mA cm−2 and exceeds considerably that for other copper surfaces. |
| |
Keywords: | Copper Electroless deposition Surface roughness Thallium UPD Copper(II) ligands |
本文献已被 ScienceDirect 等数据库收录! |