| 无氰化学镀金技术的发展及展望 |
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| 引用本文： | 刘海萍,李宁,毕四富,孔令涛,李康.无氰化学镀金技术的发展及展望[J].电镀与环保,2007,27(3):4-7. |
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| 作者姓名： | 刘海萍 李宁 毕四富 孔令涛 李康 |
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| 作者单位： | 1. 哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001
2. 哈尔滨工业大学(威海)海洋学院,化学工程与工艺,山东,威海,264209 |
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| 摘 要： | 综述了化学镀金的研究进展.详细阐述以亚硫酸钠及硫代硫酸钠为配位剂的无氰化学镀金的研究及发展现状.同时介绍了用于印刷线路板(PCB)的置换镀金工艺现状及前景,以期对无氰化学镀金的研究现状及未来发展有更好的了解.
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| 关 键 词： | 无氰 化学镀金 配位剂 亚硫酸钠 |
| 文章编号： | 1000-4742（2007）03-0004-04 |
| 修稿时间： | 2006-09-15 |
Development and Prospect of Non-cyanide Electroless Gold Plating |
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| LIU Hai-ping,LI Ning,BI Si-fu,KONG Ling-tao,LI-Kang.Development and Prospect of Non-cyanide Electroless Gold Plating[J].Electroplating & Pollution Control,2007,27(3):4-7. |
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| Authors: | LIU Hai-ping LI Ning BI Si-fu KONG Ling-tao LI-Kang |
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| Affiliation: | 1. Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China; 2. School of the Ocean, Harbin Institute of Technology (Weihai |
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| Abstract: | The progress in research on non-cyanide electroless gold plating is reviewed. The research and status of non-cyanide electroless gold plating using sodium sulfite and/or hyposulphite as complexing agent are described in detail.The status and prospect of immersion gold plating in PCB are presented as well.The purpose is for a better understanding of the present level and future development of non-cyanide electroless gold plating. |
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| Keywords: | non-cyanide bath electroless gold plating complexing agent sodium sulfite |
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