| 提高镀层与基体结合强度的途径 |
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| 引用本文： | 余凤斌,陈莹.提高镀层与基体结合强度的途径[J].电镀与环保,2009,29(2). |
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| 作者姓名： | 余凤斌 陈莹 |
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| 作者单位： | 1. 山东天诺光电材料有限公司,山东,济南,250101
2. 山东现代职业学院,山东,济南,250100 |
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| 摘 要： | 在电镀过程中影响镀层质量的因素很多,生产过程中不可避免地要出现一些质量上的问题,其中镀层与基体的结合强度就是衡量质量的重要指标之一.通过对镀层与基体结合机理及其影响因素的探讨,提出了提高镀层与基体结合强度的途径,为改善镀层的结合力提供了参考依据.
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| 关 键 词： | 电镀 结合强度 综述 |
Ways to Improve Bonding Strength between Electrodeposit and Substrate |
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| YU Feng-bin,CHEN Ying.Ways to Improve Bonding Strength between Electrodeposit and Substrate[J].Electroplating & Pollution Control,2009,29(2). |
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| Authors: | YU Feng-bin CHEN Ying |
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| Affiliation: | 1.Shandong Tiannuo Photoelectric Material Co.;Ltd.;Jinan 250101;China;2. Shandong Modern Vocational College;Jinan 250100;China |
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| Abstract: | During electroplating,many factors affect electrodeposit quality,so quality problems are unavoidable in the production. The bonding strength between electrodeposit and substrate is just one of the important indicators in measuring product quality. Based on the exploration on the bonding mechanism between electrodeposit and substrate,ways to increase the bonding strength between electrodeposit and substrate are proposed. |
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| Keywords: | electroplating bonding strength review |
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