| 化学镀Ni-Cu-P工艺及性能研究 |
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| 引用本文： | 张云霞.化学镀Ni-Cu-P工艺及性能研究[J].电镀与环保,2011,31(2):18-19. |
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| 作者姓名： | 张云霞 |
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| 作者单位： | 辽宁石油化工大学继续教育学院,辽宁抚顺,113001 |
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| 摘 要： | 三元合金可以进一步提高Ni-P镀层的性能.在化学镀Ni-P基础镀液中加入CuSO4,考察了CuSO4对镀层沉积速率、表面相貌、显微硬度以及耐蚀性能的影响.结果表明:CuSO4提高了Ni-P镀层的沉积速率,减少了镀层表面的缺陷,改善了镀层的致密性和光亮度,提高了镀层的耐蚀性.
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| 关 键 词： | 化学镀 硫酸铜 耐蚀性 |
A Study of Electroless Ni-Cu-P Process and Properties |
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| ZHANG Yun-xia.A Study of Electroless Ni-Cu-P Process and Properties[J].Electroplating & Pollution Control,2011,31(2):18-19. |
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| Authors: | ZHANG Yun-xia |
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| Affiliation: | ZHANG Yun-xia(College of Further Education,Liaoning Petrochemical University,Fushun 113001,China) |
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| Abstract: | Ternary alloys can further improve the properties of Ni-P coating.CuSO_4 was added to basic electroless Ni-P plating bath,and the effects of CuSO_4 on the deposition rate,morphology,micro-hardness and corrosion resistance of the coating were investigated.The results show that CuSO_4 can raise the deposition rate,reduce surface defects and improve compactness and brightness of Ni-P coating,thus the corrosion resistance of the coating is improved. |
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| Keywords: | electroless plating copper sulfate corrosion resistance |
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