| 前处理工艺对印刷线路板表面化学镀镍/置换镀金层性能的影响 |
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| 引用本文： | 刘海萍,毕四富,李宁.前处理工艺对印刷线路板表面化学镀镍/置换镀金层性能的影响[J].电镀与环保,2011,31(5):20-23. |
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| 作者姓名： | 刘海萍 毕四富 李宁 |
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| 作者单位： | 哈尔滨工业大学(威海)海洋学院,山东威海,264209 |
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| 基金项目： | 哈尔滨工业大学(威海)研究基金(HIT(wh)XB200802); 中央高校基本科研业务费专项资金资助(项目资助编号HIT.NSRIF.2009155) |
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| 摘 要： | 分析了酸洗、微刻蚀及活化等前处理工艺对印刷线路板(PCB)表面化学镀镍/置换镀金层性能的影响.结果表明:备前处理工序对PCB表面性能具有较大影响,在此基础上得到了优化后的前处理工艺.
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| 关 键 词： | 印刷线路板 化学镀镍 置换镀金 前处理工艺 |
Effects of Pretreatment on Properties of Electroless Nickel/Immersion Gold Coating on PCB Surface |
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| LIU Hai-ping,BI Si-fu,LI Ning.Effects of Pretreatment on Properties of Electroless Nickel/Immersion Gold Coating on PCB Surface[J].Electroplating & Pollution Control,2011,31(5):20-23. |
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| Authors: | LIU Hai-ping BI Si-fu LI Ning |
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| Affiliation: | LIU Hai-ping,BI Si-fu,LI Ning(School of the Ocean,Harbin Institute of Technology,Weihai 264209,China) |
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| Abstract: | The effects of the pretreatment processes(such as acid cleaning,micro-etching and activation) on the properties of electroless nickel/immersion gold coating on the surface of printed circuited board(PCB) were analyzed.The results show that each of the pretreatment processes has a greater influence on the surface properties of PCB.On this basis,an optimal pretreatment process is obtained. |
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| Keywords: | printed circuited board electroless nickel plating immersion gold pretreatment process |
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