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金刚石表面化学镀镍沉积速度影响因素分析
引用本文:朱选敏,刘桂珍,郭爱云.金刚石表面化学镀镍沉积速度影响因素分析[J].云南化工,2006,33(2):17-19,28.
作者姓名:朱选敏  刘桂珍  郭爱云
作者单位:武汉理工大学,材料复合新技术国家重点实验室,湖北,武汉,430070
摘    要:研究了以硼氢化钠为还原剂的金刚石表面化学镀N i工艺,重点探讨了镀液主要工艺参数对沉积速度的影响,获得了最佳工艺条件:硼氢化钠1.0 g/L;氯化镍30 g/L;乙二胺60 g/L;温度85℃;pH值13,并用JSM-5610LV型扫描电镜观察了原始金刚石和镀覆后的形貌。

关 键 词:预处理  化学镀镍  沉积速度
文章编号:1004-275X(2006)02-0017-03
收稿时间:2006-02-20
修稿时间:2006-02-20

Analysis on Parameters of Deposition Rate of Electroless Plating Nickel on Diamond
ZHU Xuan-min,LIU Gui-zhen,GUO Ai-yun.Analysis on Parameters of Deposition Rate of Electroless Plating Nickel on Diamond[J].Yunnan Chemical Technology,2006,33(2):17-19,28.
Authors:ZHU Xuan-min  LIU Gui-zhen  GUO Ai-yun
Affiliation:State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China
Abstract:Process for electroless plating nickel on diamond using sodium borohydride as reductant was studied,and effect of parameters on deposition rate of nickel was investigated.The optimal parameters are obtained as follows: sodium borohydride 1.0g/L,nickel chloride hexahydrate 30g/L,ethylenediamine 60g/L and reaction at 85℃ in pH 13 medium.The appearance of original diamond and the plated diamond were analyzed with JSM-5610LV SEM.
Keywords:pre-treatment  dectroless plating nickel  deposition rate
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