| 散热型印制电路板环氧胶粘剂的研究 |
| |
| 引用本文： | 肖军,郑水蓉,孙曼灵.散热型印制电路板环氧胶粘剂的研究[J].热固性树脂,2000,15(3):13-14. |
| |
| 作者姓名： | 肖军 郑水蓉 孙曼灵 |
| |
| 作者单位： | 西北工业大学,西安,710072 |
| |
| 摘 要： | 散热型金属复合印制电路板 (HDPCB)是使电子设备更加轻型化、小型化、简单化 ,同时能提高其可靠性的措施之一。用改性环氧胶粘剂制得的HDPCB能满足航空机载电子设备的使用要求 ,实现了HDPCB的国产化。
|
| 关 键 词： | 散热型印制电路板 改性环氧胶粘剂 |
| 修稿时间： | 1999-11-19 |
THE STUDY ON EPOXY ADHESIVE FOR HEAT-DIFFUSIVE PRINTED CIRCUIT BOARDS |
| |
| Xiao Jun,Zheng Shuirong,Sun Manling.THE STUDY ON EPOXY ADHESIVE FOR HEAT-DIFFUSIVE PRINTED CIRCUIT BOARDS[J].Thermosetting Resin,2000,15(3):13-14. |
| |
| Authors: | Xiao Jun Zheng Shuirong Sun Manling |
| |
| Abstract: | Heat diffusive printed circuit board(HDPCB)was an important measure to make electronic devices lighter,smaller,simpler and more reliable.It had been utilized in many fields especially in aviation industry.The study on HDPCD with the modified epoxy adhesive showed that it met the requirements of electronic devices for airplanes and its production was available domestically. |
| |
| Keywords: | HDPCB Modified epoxy Adhesive |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
