The origin of interfacial delamination in Au/ceramic cofired LTCC structure |
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| Affiliation: | 1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China;2. School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China;3. College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, 410073, China |
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| Abstract: | The interfacial delamination of electrode/ceramic multilayer structure will seriously damage the reliability of low temperature co-fired ceramic (LTCC) module in practical applications. In this work, three kinds of glasses employed in Au electrode are designed and prepared to study the abnormal expansion and delamination process in the Au/ceramic LTCC multilayer structure. The interfacial delamination in the co-fired structure is found to be attributed to the abnormal expansion of glass in respect to Au electrode at high temperature, which is originated from the enlarged closed pores during the co-firing process. This conclusion is further confirmed by co-firing the sample in a low-pressure condition. The mechanism and elimination of interfacial delamination here provides a feasible solution for the design of novel glasses in Au electrode for LTCC applications. |
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| Keywords: | High-temperature expansion Interfacial delamination Au electrode LTCC |
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