Materialwissenschaftliche Analyse des Abbindeverhaltens von Holzklebstoffen am Beispiel von 1K-PUR

The curing of wood adhesives has so far been evaluated on a basis of parameters, which offer process optimization only to a small degree. However, the curing becomes analyzable in detail by using oscillation measurements and a test setup adapted to the bonding process. With time sweep measurements, the adhesion process can be divided into characteristic ranges of molecular and structural processes. This method is presented and analyzed using a polyurethane prepolymer for joining wood-based materials.