| 连续高速电镀技术在集成电路引线框架生产中的应用 |
| |
| 引用本文： | 冯小龙.连续高速电镀技术在集成电路引线框架生产中的应用[J].电镀与涂饰,2003,22(6):48-51. |
| |
| 作者姓名： | 冯小龙 |
| |
| 作者单位： | 宁波康强电子股份有限公司,浙江,宁波,315105 |
| |
| 摘 要： | 介绍了集成电路引线框架镀层特点及其卷对卷式连续高速局部电镀银技术。分析了高速镀银工艺条件，并与传统氰化物镀银工艺进行了比较。简单介绍了局部电镀技术的原理及方法。
|
| 关 键 词： | 集成电路引线框架 连续高速镀银 点镀 |
| 文章编号： | 1004-227X(2003)06-0048-04 |
Application of continuous high speed plating technology in IC lead frame production |
| |
| FENG Xiao-long.Application of continuous high speed plating technology in IC lead frame production[J].Electroplating & Finishing,2003,22(6):48-51. |
| |
| Authors: | FENG Xiao-long |
| |
| Abstract: | The paper introduced features of coalings on IC (integrated circuit) lead frame and technology of reel-to-reel continuous high speed Ag local spot plating for IC lead frame. Process of high speed spol plating was analysed and compared with traditional Ag plating in cyanide solution. Principle and methods of local spot plating for 1C lead frame were briefly introduced. |
| |
| Keywords: | lead frame continuous high speed Ag plating spot plating |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
