镍网上无氰镀银-钯合金工艺

研究了一种氯化物无氰电镀Ag-Pd合金工艺,通过正交试验得出最佳配方及工艺条件:氯化锂520 g/L,氯化钯1.31 g/L,硝酸银3.11 g/L,添加剂为0.05 g/L硫脲和0.2 g/L氯化镍,pH 为2.0,温度60℃,阴极电流密度0.15 A/dm2.测试表明,该镀液性能稳定,分散能力为86.75％,覆盖能...

Non-cyanide process for plating sliver-palladium alloy on nickel mesh

A chloride non-cyanide sliver-palladium alloy plating process was studied.The optimal process conditions were determined by orthogonal test as follows:lithium chloride 520 g/L,palladium chloride 1.31 g/L,silver nitrate 3.11 g/L,thiourea 0.05 g/L and nickel chloride 0.2 g/L as additives,temperature 60 °C,pH 2.0,and cathodic current density 0.15 A/dm2.The test results showed that the plating bath is stable with throwing power 86.75% and covering power 4.53.The alloy coating contains silver 72.89%,palladium 22.68% and nickel 4.43%,has a thickness of 20 μm as well as a brightness over grade two,and features fine and uniform grain,good adhesion and high corrosion resistance.