脉冲电镀中脉冲参数对镍镀层显微硬度的影响

采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。研究了脉冲参数对镀层微观形貌与显微硬度的影 响。结果表明:镀层表面形貌为胞状结构;随着脉冲峰值电流密度的增加,胞状结构的尺寸逐渐变小,镀层显微硬度先增 加后减小;随着占空比的减小,最大显微硬度值对应的峰值电流密度增大,占空比减小到一定值后,峰值电流密度的改变 对显微硬度影响不再明显。

Influences of pulse plating parameters on micro-hardness of nickel deposits

Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating . The influences of pulse parameters on the micro-morphology and micro-hardness of the nickel deposit were studied. The results show that the nickel deposit has cystiform structure and with the increase of peak current density of pulse the diameter of the cystiform structure decreases but the micro-hardness of the deposit increases firstly and then decreases. Moreover, the peak current density corresponding to the max micro-hardness value increases with the decrease of pulse duty. When the pulse duty decreases to a certain value, the variation of peak current density has no obvious effect on the micro-hardness of the deposit.