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印制板用电解铜箔后处理工艺的研究
引用本文:杨培霞,安茂忠,胡旭日,徐树民,蒲宇达.印制板用电解铜箔后处理工艺的研究[J].电镀与涂饰,2005,24(8):42-45.
作者姓名:杨培霞  安茂忠  胡旭日  徐树民  蒲宇达
作者单位:1. 哈尔滨工业大学应用化学系,哈尔滨,150001
2. 招远金宝电子有限公司铜箔三厂,招远,265400
摘    要:研究了一种新的印制板用电解铜箔后处理工艺,依次进行电镀Zn—Ni基三元合金、铬酸盐钝化、浸有机膜等。给出了电镀Zn—M基三元合金和铬酸盐钝化的工艺参数,并对各影响因素进行了分析。对经过上述工艺处理的电解铜箔进行了性能测试,结果表明,经过该工艺处理的电解铜箔的耐蚀性、耐热性和与印制板基体的结合强度等均有明显提高,铜箔的抗剥强度为2.15,劣化率为1.38%。

关 键 词:印制板  电解铜箔  后处理工艺
文章编号:1004-227X(2005)08-0042-04
收稿时间:2005-03-02
修稿时间:2005-03-02

A post-treatment technics on electrolytic copper foil used for printed board
YANG Pei-xia,AN Mao-zhong,HU Xu-ri,XU Shu-min,PU Yu-da.A post-treatment technics on electrolytic copper foil used for printed board[J].Electroplating & Finishing,2005,24(8):42-45.
Authors:YANG Pei-xia  AN Mao-zhong  HU Xu-ri  XU Shu-min  PU Yu-da
Abstract:A new post-treatment technics on electrolytic copper foil used for printed board was studied, including electroplating Zn-Ni based ternary alloy, chromate passivation, dipping for organic film. The technological parameters of electroplating ternary alloy and chromate passivation were given and the factors influencing the parameters were analysed. The performance of copper foil obtained with above technology was tested. The results prove that the corrosion resistance, thermostability and adhesion between copper foil obtained with above technology and substrate are improved obviously, and the peeling resistant strength of copper foil is 2.15, with a deterioration percentage of 1.38%.
Keywords:printed board  electrolytic copper foil  post-treatment technics
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