| 镀彩色镍 |
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| 引用本文： | 程沪生.镀彩色镍[J].电镀与涂饰,2010,29(1):15-16. |
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| 作者姓名： | 程沪生 |
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| 作者单位： | 广州大道北同和街云涛花园七幢404室,广东广州,510515 |
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| 摘 要： | 镀彩色镍并非在镀件上沉积出各种色泽的镍层,而是光通过镀件表面不同厚度的镀镍膜发生折射、反射及光的干涉作用后形成不同的色泽。因此,控制沉积厚度即可控制镍镀层的色泽。本文介绍了镀彩色镍工艺配方和参数,指出控制镀液中的离子浓度(尤其是SCN?的浓度)、沉积时间、镀液温度及电流密度是镀彩色镍的关键。
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| 关 键 词： | 镀彩色镍 着色 硫氰酸根 镀层厚度 |
Color nickel plating |
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| CHENG Hu-sheng.Color nickel plating[J].Electroplating & Finishing,2010,29(1):15-16. |
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| Authors: | CHENG Hu-sheng |
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| Affiliation: | CHENG Hu-sheng Room 404,7th Block,Yuntao Garden,Tonghe Street,North of Guangzhou Road,Guangzhou 510515,China |
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| Abstract: | The color nickel plating is not a process in which nickel coating with various color and luster is deposited on the workpiece. Different colors and lusters may produced by refraction,reflection and interference of light irradiated onto and passed through the nickel film with various thickness on the surface of workpiece. Therefore,controlling deposit thickness can control color and luster of nickel film. This article introduces process formula and parameters of color nickel plating. It is noted that the con... |
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| Keywords: | color nickel plating coloring thiocyanate coating thickness |
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