最概然Malek法分析TDE 85/MeNA环氧树脂体系固化机理

 采用非等温DSC法对三官能团环氧树脂TDE 85与甲基纳迪克酸酐（MeNA）固化体系进行了放热特性分析，升 温速率分别为5k/min、10k/min、15k/min、20k/min、25k/min及35k/min。在此基础上重点提出最概然Malek Flynn Wall Ozawa分析法，对其固化反应机理进行固化动力学参数分析，建立了能够正确描述固化反应过程的机 理模型。该方法求得固化体系反应表观活化能为E=67.05kJ/mol，表观指前因子为A=5.05×109s 1，反应机理函数 为f(a)=22.24(1-a)1.76。最后通过实验数据对最概然Malek Flynn Wall Ozawa分析法进行验证，证明该方法 能够精确的描述固化反应过程和机理特征。

THE USING OF MALEK AND FLYNN-WALL-OZAWA EQUATION IN CURING REACTION OF TDE-85/MENA EPOXY RESIN SYSTEM

The kinetics of the cure reaction for a system of TDE 85/MeNA epoxy resin was monitored by the differential scanning calorimetry(DSC) and investigated by the constant heating methods. According to the DSC graphs， the T β graph extrapolation was used to get the characteristic curing process temperatures， and to confirm the technical parameters of the molding process of the resin system. The kinetic parameters of the curing reaction of TDE 85/MeNA epoxy resin such as the overall activation energy Ea， the frequency factor A and the reaction equation were obtained， the results were that : E=67.05kJ/mol， A=5.05×109s 1.The curing reaction was calculated accurately by using the correct kinetic model，and was set up by using Malek and Flynn Wall Ozawa equation. The result of comparing the heating flow graph from the kinetic model and the examination was in harmony ， it illuminated that the kinetic model could be used to depict the curing reaction of the TDE 85/MeNA epoxy system.