| 共烧陶瓷多层基板技术及其发展应用 |
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| 引用本文： | 姬忠涛,张正富.共烧陶瓷多层基板技术及其发展应用[J].中国陶瓷工业,2006,13(4):45-48. |
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| 作者姓名： | 姬忠涛 张正富 |
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| 作者单位： | 昆明理工大学材料与冶金工程学院,650000 |
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| 摘 要： | 论述了高温共烧陶瓷与低温共烧陶瓷的优缺点，并讨论了多层共烧陶瓷的材料选择、工艺过程与控制，然后在提高材料性能方面提出了一些建议和方法，同时介绍了多层共烧陶瓷的国内外研究状况及今后的发展趋势。
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| 关 键 词： | 多层基板 封装 共烧陶瓷 |
| 文章编号： | 1006-2874（2006）04-0045-04 |
| 收稿时间： | 2006-03-16 |
| 修稿时间： | 2006年3月16日 |
PROGRESS AND APPLICATION OF CO-FIRED MULTILAYER CERAMIC SUBSTRATE TECHNOLOGY |
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| Ji Zhongtao,Zhang Zhengfu.PROGRESS AND APPLICATION OF CO-FIRED MULTILAYER CERAMIC SUBSTRATE TECHNOLOGY[J].China Ceramic Industry,2006,13(4):45-48. |
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| Authors: | Ji Zhongtao Zhang Zhengfu |
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| Affiliation: | Faculty of Materials and Metallurgical Engineering, Kunming University of Science and Technology, 650000 |
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| Abstract: | This paper describes the advantages and disadvantages of HTCC and LTCC and discusses the selection and processing properties of cofired multilayer ceramics. Then some suggestions and methods in improving material performances are proposed. The present status and trends of developing co-fired multilayer ceramic materials are also described. |
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| Keywords: | HTCC LTCC |
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