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氢氧化铝对导热加成型有机硅灌封胶性能的影响
引用本文:潘科学,赖学军,李红强,曾幸荣.氢氧化铝对导热加成型有机硅灌封胶性能的影响[J].橡胶工业,2017,64(9).
作者姓名:潘科学  赖学军  李红强  曾幸荣
作者单位:华南理工大学材料科学与工程学院,华南理工大学材料科学与工程学院,华南理工大学材料科学与工程学院,华南理工大学材料科学与工程学院
基金项目:粤港关键领域重点突破项目(项目编号:2008A092000002)
摘    要:以粘度为300和1 000 mPa·s的端乙烯基硅油复配,含氢硅油为交联剂,三氧化二铝为导热填料,氢氧化铝Al(OH)_3]为阻燃剂,制备了无卤阻燃导热加成型有机硅灌封胶,研究Al(OH)_3用量对导热加成型有机硅灌封胶性能的影响。结果表明:随着Al(OH)_3用量的增大,加成型有机硅灌封胶的阻燃性能和导热性能提高,粘度增大,体积电阻率和物理性能下降;当Al(OH)_3用量为60份时,加成型有机硅灌封胶的综合性能最佳。

关 键 词:有机硅灌封胶  加成型  阻燃  导热
收稿时间:2015/7/14 0:00:00
修稿时间:2015/7/14 0:00:00

Effect of Aluminium Hydroxide on Properties of Thermal Conductive Addition-Cure Silicone Encapsulant
PAN Ke-xue,LAI Xue-jun,LI Hong-qiang and ZENG Xing-rong.Effect of Aluminium Hydroxide on Properties of Thermal Conductive Addition-Cure Silicone Encapsulant[J].China Rubber Industry,2017,64(9).
Authors:PAN Ke-xue  LAI Xue-jun  LI Hong-qiang and ZENG Xing-rong
Affiliation:College of Materials Science and Engineering,South China University of Technology,College of Materials Science and Engineering,South China University of Technology,College of Materials Science and Engineering,South China University of Technology,College of Materials Science and Engineering,South China University of Technology
Abstract:Halogen-free flame retardant and thermal conductive addition-cure silicone encapsulant was prepared using complex of vinyl end silicone oils with viscosity of 300mPa.s and 1000mPa.s, hydrogen silicone oil as cross-linker, alumina (Al2O3) as thermally conductive filler, aluminium hydroxide (Al(OH)3) as flame retardant. The effect of aluminium hydroxide on properties of thermal conductive addition-cure silicone encapsulant was investigated. The results showed that with the increase of the amount of Al(OH)3, flame retardancy and thermal conductivity of the encapsulant enhanced, viscosity of the encapsulant increased, and volume resistivity and mechanical properties of the encapsulant decreased. When the content of Al(OH)3 was 60phr, silicone encapsulant showed good comprehensive performance.
Keywords:silicone encapsulant  addition-cure  flame retardant  thermal conductivity
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