Interplay between adhesion and interfacial properties of diamond films deposited on WC-10%Co substrates using a CrN interlayer |
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| Affiliation: | 1. Department of Physics, Nano Functional Materials Technology Centre (NFMTC) and Materials Science Research Centre (MSRC), Indian Institute of Technology Madras (IITM), Chennai 600036, India;2. Department of Physics, National Institute of Technology (NIT), Kozhikode 673601, India;3. UGC DAE Consortium for Scientific Research, Khandwa Road, Indore 01, India;4. Department of Physics, Low Temperature Physics Laboratory, Indian Institute of Technology Madras, Chennai 600036, India;1. Nano Functional Materials Technology Centre, Indian Institute of Technology Madras, Chennai-36, India;2. Department of Physics, Indian Institute of Technology Madras, Chennai-36, India;3. Manufacturing Engineering Section, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai-36, India;4. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Madras, Chennai-36, India;5. Corporate Technology Centre, Tube Investment of India Pvt. Ltd., Chennai, India;1. Department of Electronic Information Materials, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China;2. Shanghai Well-Sun Precision Tool Co., Ltd, 868 Zhenchen Rd., Baoshan Urban Industrial Park, Shanghai, China;1. State Key Laboratory of Microbial Technology, Shandong University, No.72 Binhai Road, Qingdao 266237, China;2. College of Material Science and Engineering, Key Laboratory of Advanced Structural Materials, Ministry of Education, Changchun University of Technology, Changchun 130012, China;3. Shenyang National Lab of Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;4. Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK S7N 5A9, Canada;1. Institute of Super-hard Cutting Tool Materials, China University of Mining & Technology, Beijing 100083, China;2. China University of Mining and Technology, Beijing School of Mechanical, Electrical and Information Engineering, China |
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| Abstract: | In this study, the effect of deposition temperature on the adhesion of diamond films deposited on WC-10%Co substrates with a Cr-N interlayer is investigated. Diamond films were deposited at different temperatures (550, 650 and 750 °C), using a hot filament chemical vapor deposition reactor. It was found that the optimal adhesion is obtained for the film deposited at 650 °C. The interplay between carbon interfacial diffusion and the adhesion of diamond films deposited at different deposition temperatures were investigated. The combined use of different characterization techniques (Indentation tests, SIMS, XPS, XRD and SEM) shows that the adhesion strength depends on the thickness of Cr-C layer formed at the interface during diamond deposition, which is strongly influenced by the deposition temperature. It is suggested that at the optimum deposition temperature, thickness of the Cr-C layer is too low to introduce a large thermal stress at the interface and sufficiently thick enough to withstand the propagation of indentation induced cracks. |
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