| 超细钨粉化学镀铜工艺及性能研究 |
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| 引用本文： | 邹正军.超细钨粉化学镀铜工艺及性能研究[J].安徽化工,2007,33(4):21-23. |
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| 作者姓名： | 邹正军 |
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| 作者单位： | 合肥铁路工程学校物资教研室,安徽,合肥,230011 |
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| 摘 要： | 以甲醛为还原剂,采用低温、碱性化学镀制备出W-Cu复合粉体,实现了铜在W粉中的均匀分布.升温或提高镀液的pH值都会导致镀速的显著增加.X-ray分析表明,镀层中的铜以晶态存在,未发现铜的氧化物.沉积在W粉表面的高活性铜微粒加剧了W粉的团聚倾向.
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| 关 键 词： | 化学镀 W-cu复合粉体 结晶 团聚 |
| 文章编号： | 1008-553X（2007）04-0021-03 |
| 修稿时间： | 2007-04-10 |
Properties and Process of Electroless Plating Copper on Super-fine Tungsten Particles |
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| ZOU Zheng-jun.Properties and Process of Electroless Plating Copper on Super-fine Tungsten Particles[J].Anhui Chemical Industry,2007,33(4):21-23. |
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| Authors: | ZOU Zheng-jun |
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| Affiliation: | Hefei Railway Engineering School, Hefei Anhui 230011, China |
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| Abstract: | Formaldehyde used as reducing agent,W-Cu compound powders with Cu distributing evenly were successfully achieved by electroless plating copper on super-fine tungsten powders at low temperature in alkalescent solution.Raising temperature or elevating pH value for plating solution can both remarkably increase the deposition speed of copper.The X-ray analysis shows that crystalloid copper exists in the plating layer and there is no Cu2O.Copper particles newly deposited with high activity speed up the congregating of tungsten powders. |
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| Keywords: | electroless plating W-Cu compound powders crystalloid congregating |
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