| 电解铜箔镀镍处理及其性能的研究 |
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| 引用本文： | 赵为上,谈定生,王勇,范君良,韩月香.电解铜箔镀镍处理及其性能的研究[J].电镀与精饰,2006,28(4):14-16. |
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| 作者姓名： | 赵为上 谈定生 王勇 范君良 韩月香 |
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| 作者单位： | 1. 上海大学,材料科学与工程学院,上海,200072
2. 上海晶宝铜箔有限公司,上海,200434 |
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| 摘 要： | 讨论了电解铜箔镀镍工艺,并对镀镍后铜箔的一些性能进行了测试,通过与镀锌电解铜箔的一些性能比较,发现镀镍电解铜箔解决了镀锌电解铜箔存在的一些弊端,尤其是提高了电解铜箔的耐化学腐蚀性以及在对由镀镍电解铜箔制成的覆铜箔板进行蚀刻时明显地减少了侧蚀现象。
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| 关 键 词： | 电解铜箔 镀镍 耐化学腐蚀 侧蚀现象 |
| 文章编号： | 1001-3849（2006）04-0014-03 |
| 收稿时间： | 2005-08-07 |
| 修稿时间： | 2005年8月7日 |
Study on Nickel Plating Treatment and Performances of Electrolytic Copper Foil |
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| ZHAO Wei-shang,TAN Ding-sheng,WANG Yong,FAN Jun-liang,HAN Yue-xiang.Study on Nickel Plating Treatment and Performances of Electrolytic Copper Foil[J].Plating & Finishing,2006,28(4):14-16. |
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| Authors: | ZHAO Wei-shang TAN Ding-sheng WANG Yong FAN Jun-liang HAN Yue-xiang |
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| Affiliation: | 1. School of Material Science and Engineering, Shanghai University, Shanghai 200072, China; 2. Shanghai Jingbao Copper Foil Co. Ltd. , Shanghai 200434, China |
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| Abstract: | The process of nickel plating of electrolytic copper foil was discussed.Some performances of nickel plated copper foil were determined.By comparing with galvanizing product of electrolytic copper foil,the nickel plated copper foil was better in some performances.Especially the chemical corrosion resistance of nickel palted electrolytic copper foil was improved and side etching phenomenon was decreased when the copper-clad laminated board was etched. |
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| Keywords: | electrolytic copper foil nickel plating chemical corrosion resistance side etching phenomenon |
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