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非晶态化学镀Ni-Sn-P合金镀层变温晶化的研究
引用本文:于金库,窦连福,沈德久,韩瑰民,邵光杰,王玉林.非晶态化学镀Ni-Sn-P合金镀层变温晶化的研究[J].电镀与精饰,1995,17(3):8-9.
作者姓名:于金库  窦连福  沈德久  韩瑰民  邵光杰  王玉林
作者单位:秦皇岛燕山大学材料系!邮编066004
摘    要:研究了非晶态Ni-Sn-P合金镀层的变温化过程,由实验得出Ni-Sn-P合金约在350℃开始晶化,450℃左右晶化结束,并测得Ni-Sn-P合金变温晶化激活能为233KJ·moL~(-1)。

关 键 词:非晶态  Ni-Sn-P合金  晶化

Study on Thermal Crystallization of Chemical Plated Amorphous Ni-Sn-P Alloy Coating
Yu Jinku,Dou Lianfu,Shen Dejiu,Han Guimin,Shao Guangjie,Wang Yulin.Study on Thermal Crystallization of Chemical Plated Amorphous Ni-Sn-P Alloy Coating[J].Plating & Finishing,1995,17(3):8-9.
Authors:Yu Jinku  Dou Lianfu  Shen Dejiu  Han Guimin  Shao Guangjie  Wang Yulin
Abstract:Thermal crystallization of the amorphous Ni-Sn-P alloy was studied in this paper. The results show that the amorphous Ni.Sn.P alloy crystallization begins at 350C and completes at about 450C. and its crystallization activation energy is 233K J ?moL-1.
Keywords:amorphous  Ni-Sn -P  crystallization  
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