磁控溅射法制备纳米Cu薄膜及其微结构的研究

采用磁控溅射法制备出以ITO为基底的纯Cu薄膜,考察溅射时间和基底温度等工艺条件对生长Cu薄膜的影响.用电子扫描显微镜(SEM)、X射线衍射仪(XRD)对薄膜的形貌、厚度和结构进行表征.实验结果表明:在一定范围内调控衬底温度和溅射时间,可获得不同形貌、尺寸和厚度的Cu薄膜,所得薄膜的晶体结构为面心立方结构,均沿(111...

Preparation and Microstructure of Cu Thin Films by Magnetron Sputtering

Cu films based on ITO were prepared by magnetron sputtering.The effect of sputtering time and substrate temperature on the growth of Cu films were studied.The morphology and structure of the produced samples were characterized by scanning electron microscope(SEM)and X-ray diffractometer(XRD).It was shown that the size of particles constituting films can be controlled by sputtering time.In order to obtain uniform and compact films with good adhesion to substrate,the optimum time is 40 min.When the deposition time is more than 90 min,the film will peel from the ITO substrate.And,the morphology evolved from pillar-like structure to sphere-like cluster structure with increasing substrate temperature,which indicated that the morphology can be controlled by temperature.Also,such prepared Cu films are expected to be used in catalyst,solar energy cell,sensors and other fields.