Cu基功能梯度复合材料的发展及研究现状

Cu具有优良的性能,仅次于银的导电和导热性,容易塑性变形等,但铜的强度、硬度较低,耐腐蚀、耐氧化、耐磨性差等大大限制了其应用,要求既具有高导电、导热低温延展性,同时具有高强度、耐腐蚀、氧化等性能,Cu基功能梯度材料的出现满足了材料这种高导电率、高强度以及更高的性能要求,目前有Cu-Mo,Cu-WC等功能梯度材料,在导电导热性、等离子体材料等有广泛的应用。重点综述了Cu基功能梯度复合材料的各种制备方法、应用,并对其未来发展及前景进行了展望。

Research progress of Cu matrix functionally graded materials

Cu has excellent performance, the electrical and thermal conductivity only less than sil- ver, easy to plastic deformation and so on, but the strength of the copper and low hardness, poor heat resistance, abrasion resistance greatly limits its application. Requires it has high conductive, thermal conductivity, low temperature ductility, at the same time with high strength, high temperature oxi- dation resistance, etc. Cu--base FGMs meet the material the high conductivity, high strength and high performance requirements of the conductive thermal conductivity, plasma materials have wide applications, Cu--Mo, Cu -- WC functional gradient materials appeared. The preparation methods and applications of FGM are introduced, and the future of Cu base functionally graded materials are prospected.