Preparation and performance of high refractive index silicone resin‐type materials for the packaging of light‐emitting diodes |
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Authors: | Xiongfa Yang Qian Shao Linlin Yang Xiaobiao Zhu Xilin Hua Qunliang Zheng Guangxin Song Guoqiao Lai |
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Affiliation: | 1. Key Laboratory of Organosilicon Chemistry and Material Technology of Education Ministry, Hangzhou Normal University, Hangzhou 310012, China;2. Zhejiang Zhongzhou OPTO Co., Ltd., Hangzhou 311100, China |
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Abstract: | A novel high refractive index and highly transparent silicone resin‐type material for the packaging of high‐power light‐emitting diodes (LEDs) is introduced, which was synthesized by hydrosilylation of vinyl end‐capped methylphenyl silicone resin and methylphenyl hydrosilicone oil catalyzed by Karstedt's catalyst. The vinyl end‐capped methylphenyl silicone resins were prepared by hydrolysis?polycondensation method from methylphenyl diethoxysilane (MePhSi(OEt)2), phenyl triethoxysilane (PhSi(OEt)3), and vinyl dimethylethoxy silane (Me2ViSiOEt) in toluene/water mixture catalyzed by cation‐exchange resin. The vinyl end‐capped methylphenyl silicone resins were characterized by 1H‐NMR and Fourier‐transform infrared. The performances of the cured silicone resin‐type materials for LED packaging have been examined in detail. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013 |
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Keywords: | light‐emitting diodes packaging silicone resin high refractive index |
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