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Microstructural and mechanical evaluation of a Cu-based active braze alloy to join silicon nitride ceramics |
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| Authors: | M Singh Rajiv AsthanaFM Varela J Martínez-Fernández |
| Affiliation: | a Ohio Aerospace Institute, NASA Glenn Research Center, Cleveland, OH 44135, USA b Department of Engineering and Technology, University of Wisconsin-Stout, Menomonie, WI 54751, USA c Dpto. Física de la Materia Condensada-ICMSE, Universidad de Sevilla-CSIC, Avda. Reina Mercedes, s/n, 41012 Sevilla, Spain |
| Abstract: | Self-joining of St. Gobain Si3N4 (NT-154) using a ductile Cu-Al-Si-Ti active braze (Cu-ABA) was demonstrated. A reaction zone (∼2.5-3.5 μm thick) developed at the interface after 30 min brazing at 1317 K. The interface was enriched in Ti and Si. The room temperature compressive shear strengths of Si3N4/Si3N4 and Inconel/Inconel joints (the latter created to access baseline data for use with the proposed Si3N4/Inconel joints) were 140 ± 49 MPa and 207 ± 12 MPa, respectively. High-temperature shear tests were performed at 1023 K and 1073 K, and the strength of the Si3N4/Si3N4 and Inconel/Inconel joints were determined. The joints were metallurgically well-bonded for temperatures above 2/3 of the braze solidus. Scanning and transmission electron microscopy studies revealed a fine grain microstructure in the reaction layer, and large grains in the inner part of the joint with interfaces being crack-free. The observed formation of Ti5Si3 and AlN at the joint interface during brazing is discussed. |
| Keywords: | Silicon nitride Brazing Joints High-temperature strength Microstructure |
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