A ply-level electrical resistance approach to monitor crack evolution in a laminate SiC/SiC composites |
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| Affiliation: | 1. School of Materials Science and Physics, China University of Mining and Technology, Xuzhou 221116, China;2. College of Materials Science and Engineering, Xi’an University of Science and Technology, Xi’an, Shaanxi 710054, China;1. State Key laboratory of Powder Metallurgy, Central South University, Changsha 410083, China;2. National Key Laboratory of Science and Technology on High-strength Structural Materials, Central South University, Changsha 410083, China;1. Department of Materials Science and Engineering, College of Materials, Xiamen University, Xiamen 361005, China;2. Fujian Key Laboratory of Advanced Materials (Xiamen University), Xiamen 361005, China;3. Key Laboratory of High Performance Ceramics Fibers (Xiamen University), Ministry of Education, Xiamen 361005, China;1. Department of Mechanical Engineering, The University of Akron, Akron, OH, USA;2. AlphaSTAR Corporation, Long Beach, CA, USA;3. NAVAIR, Patuxent River, MD, USA |
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| Abstract: | In the aim of providing a reliable technique to monitor the development of damage in 0°/90° melt-infiltrated SiC-fiber reinforced prepreg laminate ceramic-matrix composites, it was hypothesized that the electrical resistivities of different layers of this material were significantly different due to their free Si content and morphology. Three distinct layers: a 0° fiber ply, a 90° fiber ply and a matrix only ply, were distinguished in the composite architecture. Free silicon is the most conductive phase in this composite system; however, the Si content and morphology were different in each of the three types of plies. Unidirectional and 0°/90°]2s specimens enabled quantification of ply-level resistivities. An electric circuit model was constructed; it consists of parallel resistors where each resistor represents a ply in the composite system. This ply-level electrical model was validated using composites of different vintages which contained different silicon contents. A room temperature stepped fatigue test was conducted and the ply level circuit model was used to discern crack morphology with the support of acoustic emission and digital image correlation. |
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| Keywords: | Electrical resistance Damage detection techniques SiC based prepreg laminate composite Fatigue crack growth Acoustic emission |
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