TLP连接机制与中间层问题的探讨

瞬时液相扩散焊连接（TLP）提供了一种在低温下连接各种材料的焊接方法。TLP连接方法能够产生无界面的、无中间层残留的高强度接头,在TLP连接过程中由于降熔剂的作用使得液相中间层只能够向金属母材扩散,从而产生等温定向凝固。可见中间层中扩散是TLP连接过程的关键问题,为此阐述了中间层中各项因素对连接时间的影响,结果发现中间层的厚度以及降熔剂的选择对连接时间都有很大影响。因此,应尽量避免中间层金属间化合物的产生。

Study on Transient Liquid Phase Bonding Processes and Interlayer

Transient Liquid Phase(TLP)bonding offers a method of joining the composite material in low temperature.It is capable of producing nearly invisible joints that have strong strength without interface and interlayer residual.Bonding is realized as melting point depressants(MPD)in the liquid interlayer diffuse into the metal which results in isothermal directional solidification.As the interlayer diffusion is the key point of the bonding process,so the influence of the interlayer factor was expatiated on the bonding time.It was found that the interlayer thickness and the select of the melting point depressants have the strong influence on the bonding time.In addition,it should avoid the intermetallic compound which has the bad influence on the TLP bonding process.