| Sn基钎料／Cu基板间反应润湿及界面结构研究现状 |
| |
| 引用本文： | 陈洁,于治水,刘雷,向锋.Sn基钎料／Cu基板间反应润湿及界面结构研究现状[J].上海工程技术大学学报,2009,23(3):277-281. |
| |
| 作者姓名： | 陈洁 于治水 刘雷 向锋 |
| |
| 作者单位： | 上海工程技术大学,材料工程学院,上海,201620 |
| |
| 基金项目： | 上海市教委第五期重点学科建设资助项目 |
| |
| 摘 要： | 为了防止铅（Pb）对自然环境的污染，目前人们对Sn基无铅钎料及其相关性能作了大量研究．综述了通过改变添加的合金元素种类、温度和Cu基板上的金属镀层，Sn基钎料润湿力以及界面组织形态的变化，提出了在不同实验条件下Sn基钎料的反应润湿性能不同的观点．
|
| 关 键 词： | Sn基钎料 反应润湿 润湿力 合金元素 金属镀层 |
Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate |
| |
| CHEN Jie,YU Zhi-shui,LIU Lei,XIANG Feng.Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate[J].Journal of Shanghai University of Engineering Science,2009,23(3):277-281. |
| |
| Authors: | CHEN Jie YU Zhi-shui LIU Lei XIANG Feng |
| |
| Affiliation: | (College of Material Engineering, Shanghai University of Engineering Science, Shanghai 201620, China) |
| |
| Abstract: | In order to prevent lead from polluting the natural environment, the research work on lead-free Sn-based solder and its related performance has been carried out extensively at present. This article is devoted to clarifying the mechanism of reactive wetting and summarizing the change of wetting force of Sn-based solder and the morphology of the interfacial structure by changing the type of alloying elements added to the solder,experimental temperature and metal coating on Cu substrate. A viewpoint that per-formance of reactive wetting of Sn-based solder would vary with different experimental conditions was presented. |
| |
| Keywords: | Sn-based solder reactive wetting wetting force alloying elements metal coating |
| 本文献已被 维普 万方数据 等数据库收录！ |
